Advanced mixing system for integrated tool having site-isolated reactors

ABSTRACT

An integrated processing tool is described comprising a full-wafer processing module and a combinatorial processing module. Chemicals for use in the combinatorial processing module are fed from a delivery system including a set of first manifolds. An output of each first manifold is coupled to at least one mixing vessel. An output of each mixing vessel feeds more than one of a set of second manifolds. An output of each set of second manifolds feeds one of multiple site-isolated reactors of the combinatorial processing module.

RELATED APPLICATIONS

This application is related to U.S. patent application Ser. No.11/418,689, filed May 5, 2006.

TECHNICAL FIELD

The disclosure herein relates generally to substrate processing and,more particularly, to substrate processing using integratedsite-isolated processing and full-wafer processing.

BACKGROUND

To achieve the desired performance enhancement for each successivegeneration of silicon integrated circuits (ICs), semiconductormanufacturing has become increasingly reliant on new materials and theirintegration into advanced process sequences. Unfortunately, typicalsemiconductor manufacturing equipment is not well suited for materialsexploration and integration. Issues impacting the use of typicalsemiconductor manufacturing equipment include difficulty in changingprocess materials and chemicals rapidly, limited ability to integrateand sequence multiple materials or chemicals in a single reactor orprocess chamber, high equipment cost, large sample size (300 mm wafer)and inflexible process/reactor configurations. To complement traditionalmanufacturing tools, a need has arisen for process equipment thatfacilitates fast testing of new materials and materials processingsequences over a wide range of process conditions.

SUMMARY

The embodiments provide for an integrated processing tool comprising asite-isolated reactor (SIR). The SIR includes a set of first manifolds,wherein each of the first manifolds is coupled to a plurality ofchemicals in a liquid state. The SIR includes a plurality of mixingvessels, wherein each mixing vessel is coupled to an output of each ofthe first manifolds, and wherein each of the mixing vessels includes astirring element. The SIR includes a set of second manifolds, whereineach of the second manifolds is coupled to an output of multiple mixingvessels and a plurality of flow cells, wherein each flow cell is coupledto an output of at least one of the second manifolds.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a substrate processing system (SPS), under an embodiment.

FIG. 2 is a flow diagram for combinatorial process sequence integration,under an embodiment.

FIG. 3 is a combinatorial process sequence integration process flow thatincludes site-isolated processing and/or conventional processing, underan embodiment.

FIG. 4 is a block diagram of the integrated processing tool, referred toherein as a Multiple Channel Site-Isolated Reactor (MCSIR), under anembodiment.

FIG. 5 is a site-isolated processing module (SIPM) of a MCSIR, under anembodiment.

FIG. 6 shows couplings between a subset of components of the SIPM, underan embodiment.

FIG. 7 is a block diagram of a flow cell including independent processand waste paths, under an embodiment.

FIG. 8 shows a MCSIR that includes a flow cell assembly mated to achuck, under an embodiment.

FIG. 9 shows a hydrodynamic sealing system, under an embodiment.

FIG. 10 shows a hydrodynamic sealing system, under an embodiment.

DETAILED DESCRIPTION

An integrated processing tool, referred to herein as a multiple channelsite-isolated reactor (MCSIR), is described below. The MCSIR iscomprised of a full-wafer processing module and a combinatorial,site-isolated processing module. A primary purpose of the integratedprocessing tool is to effect mixed-mode processing betweenfull-substrate and multiple, site-isolated regions of the fullsubstrate. As such, chemicals for use in the processing modules are fedfrom a common delivery system that includes a set of first manifoldsthat enable the creation of solutions whose composition can be varied ina combinatorial fashion and whose constituents can be specified as partof the recipe for the process sequence. To allow thorough solutionmixing as well as accurate temperature and pH control, the output ofeach first manifold is coupled to at least one mixing vessel. The outputof each mixing vessel is subsequently dispensed to one or more of a setof second manifolds. The output of each set of second manifolds feedsone or more reactors of the processing modules. In addition to providingsolutions that are mixed statically in mixing vessels, the second set ofmanifolds enables multiple chemicals to be distributed simultaneously tofacilitate dynamic, in-line mixing of solutions.

Regarding site-isolated processing, the MCSIR integrates multiple,independently-controlled process chambers that collectively addressmultiple independent sites on the full substrate. The MCSIR provides theability to mix and dispense a variety of chemical solutions orcompositions onto the substrate in one or more of a series and/orparallel manner, and provides the ability to independently vary flowand/or solution composition to any number of reactors or one or moresubsets of reactors. The MCSIR provides the ability to synchronizeprocess steps and control critical timing across all site-isolatedreactors when a global parameter for the process sequence requires thistype of synchronization for non-site-isolated control parameters (e.g.temperature of the wafer substrate, reactor height/volume, etc.).

By providing multiple, independently-controlled and plumbed reactors orprocess chambers across a single 200- or 300-mm silicon substrate, theMCSIR described herein addresses the issues that cause traditionalsemiconductor manufacturing equipment to not be well suited formaterials exploration and integration. The configuration and flowdynamics of each site-isolated reactor is typically scaled from aproduction reactor, facilitating process scale-up to full wafers withminimal changes to the process integration sequence. In addition,materials delivery systems of the MCSIR are configured to enable greaterflexibility in both the number of materials that are provided to thechamber as well as the steps in process sequence that are utilized toeffect the materials integration. Reactor miniaturization and relaxedequipment requirements for materials research and integration alsoreduces the cost of the equipment compared to production tools.

Systems and methods for processing a substrate (e.g., formingmaterial(s) on a substrate) are described below. The systems and methodsfor processing substrates, collectively referred to herein as “substrateprocessing systems” (SPSs), include combinatorial processing,combinatorial process sequences integrated with conventional substrateprocessing, and/or site-isolated processing, as described in detailbelow. The SPS of an embodiment enables production of very smallstructures and features on substrates (e.g., at the nanometer sizescale) at very low cost, which can be useful in the commercialmanufacturing of a variety of products, such as electronic componentsand flat panel displays to name a few. The various systems and methodsdescribed below are presented as examples only and are not intended tolimit the systems and methods described and claimed herein to particularcombinations of combinatorial processing, combinatorial processsequences integrated with conventional substrate processing, and/orsite-isolated processing. Furthermore, the systems and methods describedbelow are not limited to particular processes (e.g., wet processes, dryprocesses, etc.).

In the following description, numerous specific details are introducedto provide a thorough understanding of, and enabling description for,embodiments of the SPS. One skilled in the relevant art, however, willrecognize that these embodiments can be practiced without one or more ofthe specific details, or with other components, systems, etc. In otherinstances, well-known structures or operations are not shown, or are notdescribed in detail, to avoid obscuring aspects of the disclosedembodiments.

The SPS of an embodiment generally includes at least one interfaceconfigured to receive at least one substrate. The SPS also includes anumber of modules coupled to the interface. The modules, also referredto herein as components, include a pre-processing module, a processingmodule, and a post-processing module, but may include any number and/ortype of other modules where any of the modules may include functions ofthe pre-processing, processing, and/or post-processing modules. The SPSis not required to include at least one of each of any particular moduletype. Also, functions of all of the pre-processing, processing, andpost-processing modules may be embedded within a single module. Eachmodule of the multiple modules can contain at least one of a number ofdifferent processes as appropriate to processes contained in at leastone other of the modules. The SPS also includes at least one handlercoupled to the interface and configured to move the substrate betweenthe interface and one or more of the modules.

FIG. 1 is a substrate processing system (SPS) 100, under an embodiment.The substrate processing system 100 includes a pre-processing module101, a processing module 102, and a post-processing module 103. The SPS100 is not required to include at least one of each of the precedingmodule types; for example, a particular process flow may include onlythe processing module 102 and means for moving a substrate into and outof the system 100. Also, functions of all of the pre-processing,processing, and post-processing modules may be embedded within a singlemodule. The modules 101, 102 and 103 can each be implemented usingapparatus (in particular, conventional commercial substrate processingapparatus) as appropriate to the types of substrate processing for whichthe modules 101, 102 and 103 are to be used. The modules 101, 102, and103 can be implemented with modification(s) and/or addition(s) dependingon the particular characteristics of the substrate and/or processes.

Substrates enter and leave the system 100 via a system interface 104,also referred to as a factory interface 104. A single substrate can beprocessed at one time in the system 100 or multiple substrates can beprocessed at one time in a batch. The system interface 104 includes asubstrate handler 104 a (which can be implemented, for example, using arobot) that moves substrate(s) into and out of the system 100. Tofacilitate moving substrates into and out of the system 100, the systeminterface 104 includes a substrate load station 104 b and a substrateunloading station 104 c (also referred to as a Front Opening Unified Pod(FOUP) load station 104 b and a FOUP unload station 104 c,respectively).

After substrate(s) that have been processed are removed from the system100 and placed on the substrate unload station 104 c (for eventualmovement to another location) by the substrate handler 104 a, newsubstrate(s) that have previously been placed on the substrate loadstation 104 b are taken from the substrate load station 104 b by thesubstrate handler 104 a and moved into the system 100 for processing.The system interface 104 (including the substrate handler 104 a,substrate load station 104 b and substrate unload station 104 c) can beimplemented using conventional apparatus and methods known to thoseskilled in the art of processing substrates. The system 100 of one ormore alternative embodiments can include multiple system interfaces,each of which can be constructed and operate as described above.

Once in the system 100, a substrate handling system 105 can be used tomove substrate(s) processed by the system 100 between different modules101-103 of the system 100. Like the substrate handler 104 a of thesystem interface 104, the substrate handling system 105 can beimplemented, for example, using one or more robots. If the modules 101,102 and 103 include both wet and dry processing modules, then thesubstrate handling system 105 includes at least two types of apparatus:a dry substrate handler for moving substrate(s) into and out of dryprocessing modules and the system interface 104 and out of a dryingmodule, and a wet substrate handler for moving substrate(s) into and outof wet processing modules and into a drying module. The substratehandling system 105 can be implemented using apparatus and methods knownto those skilled in the art of processing substrates.

Other than when substrate(s) are being moved into or out of the system100 through the system interface 104, the system 100 is sealed from theexternal environment. Depending on the processing to be performed by thesystem 100, the environment within the system 100 that is outside of thepre-processing module 101, processing module 102, and post-processingmodule 103 (for convenience, sometimes referred to hereinafter as the“system environment”) can be maintained at atmospheric pressure, held ata vacuum pressure, and/or pressurized (i.e., held at a pressure aboveatmospheric pressure). Similarly, the system environment can bemaintained at the ambient temperature of the environment outside of thesystem 100, or at a temperature that is higher or lower than thatambient temperature.

Further, the gaseous composition of the system environment can becontrolled as desired. For example, the system environment can beambient air (typically, controlled to reduce contamination from theexternal environment). The system environment can also be controlled toinclude, in whole or in part, a specified gas or gases, e.g., in asystem used to process semiconductor wafers, the system environment canbe controlled to be nitrogen or an inert gas. The system environment canalso be controlled to exclude a specified gas or gases, e.g., oxygen canbe excluded from the system environment to reduce the occurrence ofoxidation of substrate(s) (or material(s) formed thereon) processed inthe system.

The SPS of an alternative embodiment can include multiples of each ofthe types of modules used to process a single wafer or single batch ofwafers; therefore, multiple versions of the SPS can operate in parallelas a single system. This can improve the throughput of substratesprocessed by the SPS. This can also add redundancy so that systemavailability can be maintained even when one or more of the modules ofthe system are rendered non-operational for a period of time (e.g., forpreventative maintenance, repair, etc.).

The SPS described above is presented as an example, and systemsincluding other numbers of processing modules can be used. Furthermore,types of processing modules other than those described above can beused. Manual loading and unloading of substrate(s) may be used in someprocessing systems instead of a substrate handler for movingsubstrate(s) into and out of the system.

The SPS 100 described above can include one or more modules (alsoreferred to as components) and/or methods for combinatorially processingregions on a single substrate. Generally, an array of regions iscombinatorially processed by delivering processing materials to one ormore regions on a substrate and/or modifying the regions. The regions ona substrate of an embodiment include but are not limited to pre-definedregions and regions identified during and/or as a result of processingof the substrate. FIG. 2 is a flow diagram for combinatorial processsequence integration, under an embodiment. The embodiment may utilize aprocessing tool (which may or may not be an integrated tool comprised ofdiscrete unit modules which collectively perform the effective unitprocess) that will perform the desired process for analysis. In oneembodiment, the processing tool can perform the process in a discretizedfashion within unique regions contained in a single monolithicsubstrate, such as a 300 mm diameter wafer used in IC manufacturing. Thesubstrate is provided to the system 200, and is processed in adiscretized, preferably isolated, fashion (either in a serial, parallel,or serial-parallel mode) whereby at least two regions of the substrateare processed differently from each other 210. The substrate processedin the combinatorial fashion can optionally be previously 220 and/orsubsequently 230 processed in a conventional fashion with at least oneprocess or process step, whereby the entire or substantially close tothe entire substrate is subject to the same processing conditions. Thisallows the described combinatorial processing/combinatorial processsequence integration approach to be used in desired segments of theprocess flow required to build an end device(s), integrated circuit,etc.

The processed regions, such as devices or portions of devices created,can be tested 240 for a property of interest using conventional methodsfor analysis, such as parametric testing for properties such as yield,via resistance, line resistance, capacitance, etc. and/or reliabilitytesting for properties such as stress migration, electromigration, biasthermal stress, time dependent dielectric breakdown, and related testingknown to those of skill in the art. The processed regions can be testedsimultaneously, sequentially, or in a parallel-serial mode, where afirst plurality of regions is simultaneously tested, followed by asecond plurality of regions being simultaneously tested. The testing 240is optionally performed in one or more alternative embodiments of themethodology for combinatorial process sequence integration.

The combinatorial process sequence integration of an embodiment uses aprocessing tool referred to herein as a site-isolated processing tool(also referred to as a site-isolated reactor (SIR)) that performs one ormore processes. In one embodiment, the site-isolated processing toolprocesses a substrate in a discretized, isolated fashion (either in aserial, parallel, or serial-parallel mode) within unique regions of thesubstrate (e.g., at least two regions of the substrate are processeddifferently from each other). In processing an array of regions, asdescribed herein, processing materials can be delivered to regions(including predefined regions) on a substrate and/or the regions(including predefined regions) can be modified using any number ofsite-isolated processing processes or sequences in combination with anynumber of conventional processing processes or sequences.

For example, a method under the combinatorial process sequenceintegration described herein receives a substrate from at least onefirst process selected from a group including depositing, patterning,etching, cleaning, planarizing, implanting, and treating. The methodgenerates a processed substrate by processing at least one region of thesubstrate differently from at least one other region of the substrate.The processing includes modifying at least one region, wherein modifyingincludes at least one of physical modifications, chemical modifications,electrical modifications, thermal modifications, magnetic modifications,photonic modifications, and photolytic modifications. The processingforms at least one array of differentially processed regions on thesubstrate. In one embodiment, the processing described above includesmodifying using at least one of materials, processing conditions,process sequences, process sequence integration, and process sequenceconditions. In one other embodiment, the processed substrate describedabove is subjected to at least one additional process selected from agroup including depositing, patterning, etching, cleaning, planarizing,implanting, and treating.

As another example, a method under the combinatorial process sequenceintegration described herein generates a processed substrate byprocessing at least one region of the substrate differently from atleast one other region of the substrate. The processing includesmodifying at least one region, wherein modifying includes at least oneof physical modifications, chemical modifications, electricalmodifications, thermal modifications, magnetic modifications, photonicmodifications, and photolytic modifications. The processing forms atleast one array of differentially processed regions on the substrate.The method continues by providing the processed substrate to at leastone additional process selected from a group including depositing,patterning, etching, cleaning, planarizing, implanting, and treating. Inone embodiment, the processing described above includes modifying usingat least one of materials, processing conditions, process sequences,process sequence integration, and process sequence conditions.

FIG. 3 is a combinatorial process sequence integration process flow 300that includes site-isolated processing and/or conventional processing,under an embodiment. One example of a processing sequence under theembodiments herein is as follows: process the substrate usingConventional Process N, then process the substrate using Site-IsolatedProcess N+1, then process the substrate using Site-Isolated Process N+2,then process the substrate using Conventional Process N+3, then performE-test (e.g., electrical testing). Another example of a processingsequence under the embodiments herein is as follows: process thesubstrate using Site-Isolated Process N, then process the substrateusing Site-Isolated Process N+1, then process the substrate usingConventional Process N+2, then process the substrate using Site-IsolatedProcess N+3, then perform E-test. Yet another example of a processingsequence under the embodiments herein is as follows: process thesubstrate using Site-Isolated Process N, then process the substrateusing Conventional Process N+1, then process the substrate usingSite-Isolated Process N+2, then process the substrate using ConventionalProcess N+3, then perform E-test. Various other processing sequences canbe effected according to the process flow 300.

The combinatorial process sequence integration thus generates forexample a semiconductor wafer 302 comprising a die array that includes aplurality of dies 304 that can be test dies and/or actual product diescontaining intended integrated circuitry. Blanket wafers, patternwafers, devices, functional chips, functional devices, test structures,semiconductors, integrated circuits, flat panel displays, optoelectronicdevices, data storage devices, magnetoelectronic devices, magnetoopticdevices, molecular electronic devices, solar cells, photonic devices,and packaged devices can be processed and/or generated using theaforementioned combinatorial process sequence integration methodology.The combinatorial process sequence integration can be applied to anydesired segment(s) and/or portion(s) of an overall process flow.Characterization, including electrical testing, can be performed aftereach process step, and/or series of process steps within the processflow as needed and/or desired.

Embodiments of the SPS deliver processing materials to one or morepredefined regions on the substrate, and react the delivered materialsusing a number of different techniques. For example, the processingmaterials can be reacted using, for example, solution based synthesistechniques, photochemical techniques, polymerization techniques,template directed synthesis techniques, epitaxial growth techniques, bythe sol-gel process, by thermal, infrared or microwave heating, bycalcination, sintering or annealing, by hydrothermal methods, by fluxmethods, by crystallization through vaporization of solvent, etc. Otheruseful reaction techniques that can be used to react the processingmaterials of interest will be readily apparent to those of skill in theart.

Since the regions of the substrate are processed independently of eachother, the processing conditions at different regions can be controlledindependently. As such, process material amounts, reactant solvents,processing temperatures, processing times, processing pressures, therates at which the reactions are quenched, deposition order of processmaterials, process sequence steps, etc. can be varied from region toregion on the substrate. Thus, for example, when exploring materials, aprocessing material delivered to a first and a second region can be thesame or different. If the processing material delivered to the firstregion is the same as the processing material delivered to the secondregion, this processing material can be offered to the first and secondregions on the substrate at either the same or different concentrations.This is true as well for additional processing materials delivered tothe first and second regions, etc. As with the processing materialdelivered to the first and second regions, the additional processingmaterials delivered to the first and second regions can be the same ordifferent and, if the same, can be offered to the first and secondregions on the substrate at either the same or different concentrations.

Moreover, within a given predefined region on the substrate, theprocessing materials can be delivered in either a uniform or gradientfashion. If the same processing materials are delivered to the first andsecond regions of the substrate at identical concentrations, then theconditions (e.g., reaction temperatures, reaction times, etc.) underwhich the regions are processed can be varied from region to region.Parameters which can be varied include, for example, material amounts,solvents, process temperatures, process times, the pressures at whichthe processes are carried out, the atmospheres in which the processesare conducted, the rates at which the processes are quenched, the orderin which the materials are deposited, etc. Other process parameterswhich can be varied will be apparent to those of skill in the art.

Moreover, an embodiment provides for forming at least two differentarrays of materials by delivering substantially the same processingmaterials at approximately identical concentrations to correspondingregions on both first and second substrates having different surfaces,such as a dielectric material surface and an electrically conductivesurface, in order to represent different portions of regions on an ICchip, and, thereafter, subjecting the process materials on thesubstrates to a first set of process conditions. Using this method, theeffects of the process parameters or materials on the various substratesurfaces can be studied and, in turn, optimized.

The processing materials utilized in the processing of the individualregions must often be prevented from moving to adjacent regions. Mostsimply, this can be ensured by leaving a sufficient amount of spacebetween the regions on the substrate so that the various processingmaterials cannot interdiffuse between regions. Moreover, this can beensured by providing an appropriate barrier between the various regionson the substrate during processing. In one approach, a mechanical deviceor physical structure defines the various regions on the substrate. Awall or other physical barrier, for example, can be used to prevent thematerials in the individual regions from moving to adjacent regions.This wall or physical barrier may be removed after the synthesis iscompleted. One of skill in the art will appreciate that, at times, itmay be beneficial to remove the wall or physical barrier beforescreening the array of materials.

In other embodiments, the processing may be effected without the need ofbarriers which physically touch the substrate. For example, lasers,radiative lamps, UV radiation sources, other “point” sources can be usedto process regions in a site addressable fashion as the area ofmodification is nominally smaller and/or equivalent in size to thediscrete regions of interest on the substrate. In yet anotherembodiment, a physical barrier can be used to essentially screen and/orlimit the processing to a desired region(s) and/or portion(s) of aregion(s) wherein the physical barrier does not physically touch thesubstrate. For example, a physical barrier can be used to essentiallyblock and/or restrict processing to certain region(s) and/or portion(s)or region(s). A screen, such as a mask or shutter, can be used to blockvapor fluxes such as from PVD (i.e. sputtering) or evaporation sourcesfor example. An opaque vs. transparent mask can be used to let certainradiation through the transparent regions to effect processing inspecified regions on the substrate. In yet another embodiment, gasflows, of preferably an inert gas such as argon (Ar), can be used toscreen out gaseous reagents and or limit the concentrations of suchreagents so as to effectively screen out the effects of such reagentsfrom certain regions. In this fashion, specific regions on a substratecan be processed differently without the need for a physical barrier incommunication with the substrate. This approach is particularly amenableto sequential gas phase vacuum based surface kinetic processes such asatomic layer deposition and various forms thereof (e.g., ion, radical,and plasma induced/enhanced).

The SPSs of an embodiment include processing tools configured to effectboth uniform processing across an entire substrate and independentprocessing of one or more discrete regions of the substrateindividually. The processing tools described herein, which includeoperations under the combinatorial process sequence integration processflows described above with reference to FIGS. 2 and 3, can be acomponent of a substrate processing system like the SPS 100 describedabove and/or one or more modules of the SPS 100 described above withreference to FIG. 1. The combinatorial process sequence integrationprocess flow 300 of FIG. 3 can be embodied in a processing module 102 ofthe SPS 100 (FIG. 1), for example. Similarly, the combinatorial processsequence integration process flow 300 can be embodied across one or moreprocessing modules 101, 102, and 103 of the SPS 100 (FIG. 1) as anotherexample.

The SPSs of an embodiment includes an integrated processing tool thatsupports both full-wafer processing and combinatorial processing. FIG. 4is a block diagram of the integrated processing tool 400, referred toherein as a Multiple Channel Site-Isolated Reactor (MCSIR) 400, under anembodiment. The MSCIR 400 includes a full-wafer processing module 405and a site-isolated processing module (SIPM) 409, as described in detailbelow. The MCSIR 400 incorporates a bulk chemical distribution system toprovide the raw chemicals 401 necessary to effect the process sequence,as well as chemical mixing and sequencing hardware in the form of mixingvessels and distribution manifolds to provide the ability to dynamicallymix chemical solutions of any composition as well as to sequence thechemicals through the reactors in any order for any time duration. TheMCSIR 400 is controlled using a computerized hardware controller 402,and the same controller of an embodiment effects processing in both thefull-wafer reactor and site-isolated reactor. Wafers are sequencedthrough the MCSIR 400 using a factory interface 404. The full-wafer andsite-isolated reactors are comparable in all control aspects. Eachreactor or channel of the MCSIR 400 is configured to allow theimplementation of complex wet/vapor-process sequences as describedherein.

Generally, the full-wafer processing module 405 includes a processmanifold coupled to a full-wafer reactor. The process manifold iscoupled to the chemicals 401 and is configured to feed or deliver thechemicals 401 to the full-wafer reactor. The full-wafer reactor isconfigured to effect uniform processing across the entire wafer orsubstrate surface (e.g., 8-inch wafer, 12-inch wafer, etc.) using thedelivered chemicals.

In contrast, the SIPM 409 is a site-isolated processor that enablesindependent processing of multiple discrete regions (e.g., 28 regions)across the wafer using multiple channels or process paths. This exampleof the SIPM 409 shows a single site-isolated reactor being fed by eitherof two process paths or channels for the sake of clarity of thisexample, but the MCSIR can include any number of site-isolated reactorsand any number of process paths connected to each reactor.

The SIPM 409 feeds or distributes the chemicals 401 using a deliverysystem generally including a set or assembly of first manifolds (e.g.,mixing vessel (MV) 1 manifold). An output of each first manifold iscoupled to a mixing vessel (e.g., mixing vessel 1, etc.). The mixingvessel manifolds allow mixing of the bulk chemicals in any ratio foreach of the mixing vessels, and the mixing vessels then serve astemporary storage for the mixed chemical solutions.

The output of each mixing vessel feeds one or more of a set of secondmanifolds (e.g., process channel 1 site manifold, process channel 2 sitemanifold). An output of each set of second manifolds feeds asite-isolated reactor. The set of second manifolds generally allowssequencing of the mixing vessel solutions and/or bulk chemicals througheither of two process paths (e.g., channel 1, channel 2) in a set offlow cells. The flow cells comprise the top surface of the site-isolatedreactor, and reactor sleeves comprise the side walls of the reactor. Theprocessed substrate comprises the bottom of the reactor. Eachsite-isolated reactor effects individual processing of a dedicatedregion of the substrate as described herein.

The example of MCSIR 400 does not include a mixing vessel in the processpath for the full-wafer reactor. However, it is possible and sometimesdesirable to include a mixing vessel in the full-wafer reactor processpath in order to configure the full-wafer processing module in a mannersimilar to that of the SIPM.

FIG. 5 is a SIPM 500 of a MCSIR, under an embodiment. The SIPM 500manages or controls simultaneous processing of different regions of asubstrate by simultaneously controlling reactions in multiple parallelreactors. Each of the reactors is located proximate to a particularregion of a substrate (e.g., wafer). The reactor control includescontrolling reagent flow, reagent mixing, reagent delivery, reagentand/or reactor temperature, and/or reagent pH to name a few.

The SIPM 500 includes a first dispense assembly 512 coupled to a firstmixing assembly 514. The first dispense assembly 512 includes a number Nof mixing vessel manifolds 5121-512N, where the number N of mixingvessel manifolds can be any number. The first dispense assembly 512 ofan embodiment includes twenty-eight (28) mixing vessel manifolds, butthe SPS is not limited to this number of mixing vessel manifolds and caninclude any number of mixing vessel manifolds. The inputs of each of themixing vessel manifolds are coupled to one or more of the chemicals 501.As an example, a mixing vessel manifold of an embodiment includes eight(8) inputs, and each of the inputs is connected to a different one ofthe chemicals 501. The mixing vessel manifolds are however not limitedto eight (8) inputs, and each input is not limited to connection to adifferent constituent from any other manifold input. Additionally, allmixing vessel manifolds of the dispense assembly 512 are not limited tobeing of the same configuration. Furthermore, other components (e.g.,valves, regulators, mixers, pumps, etc.) can be connected inline betweenthe constituents and the mixing vessel manifolds.

The first mixing assembly 514 includes a number N of mixing vessels5141-514N, where the number N of mixing vessels can be any number. Thefirst mixing assembly 514 of an embodiment includes twenty-eight (28)mixing vessels, but the SPS is not limited to this number of mixingvessels and can include any number of mixing vessels. The inputs of eachof the mixing vessels are coupled to outputs of the mixing vesselmanifolds of the first dispense assembly 512. As an example, the mixingvessel of an embodiment includes one (1) input that is connected to anoutput of a mixing vessel manifold of the first dispense assembly 512.As a more specific example, an input of a first mixing vessel 5141 isconnected to an output of a first mixing vessel manifold 5121. Themixing vessels are however not limited to one (1) input, and each inputis not limited to connection to one mixing vessel manifold of the firstdispense assembly 512.

The SIPM 500 further includes a second dispense assembly 522 coupled toa second mixing assembly 524. The second dispense assembly 522 includesa number N of mixing vessel manifolds 5221-522N, where the number N ofmixing vessel manifolds can be any number. The second dispense assembly522 of an embodiment includes twenty-eight (28) mixing vessel manifolds,but the SPS is not limited to this number of mixing vessel manifolds.The inputs of each of the mixing vessel manifolds are coupled to one ormore of the chemicals 501. As an example, and as described above, themixing vessel manifold of an embodiment includes eight (8) inputs, andeach of the inputs is connected to a different one of the chemicals 501.The mixing vessel manifolds are however not limited to eight (8) inputs,and each input is not limited to connection to a different constituentfrom any other manifold input. Additionally, other components (e.g.,valves, regulators, mixers, etc.) can be connected inline between theconstituents and the mixing vessel manifolds.

The second mixing assembly 524 includes a number N of mixing vessels5241-524N, where the number N of mixing vessels can be any number. Thesecond mixing assembly 524 of an embodiment includes twenty-eight 28mixing vessels, but the SPS is not limited to this number of mixingvessels. The inputs of each of the mixing vessels are coupled to outputsof the mixing vessel manifolds of the first dispense assembly 522. As anexample, the mixing vessel of an embodiment includes one (1) input thatis connected to an output of a mixing vessel manifold of the firstdispense assembly 522. As a more specific example, an input of a firstmixing vessel 5241 is connected to an output of a first mixing vesselmanifold 5221. The mixing vessels are however not limited to one (1)input, and each input is not limited to connection one mixing vesselmanifold of the first dispense assembly 522.

The SPS is modular so alternative embodiments of the SPS can include adifferent number of dispense assemblies and/or mixing assemblies. Forexample, the SPS of an alternative embodiment can include two additionaldispense assemblies, with each additional dispense assembly coupled toan additional mixing assembly. As another example, the SPS of analternative embodiment includes only the first dispense assembly 512 andfirst mixing assembly 514 described above, and does not include thesecond dispense assembly 522 and second mixing assembly 524.Furthermore, the SPS of alternative embodiments can include a smaller orlarger number of mixing vessel manifolds and/or mixing vessels thandescribed above. Additionally, alternative embodiments include differentconfigurations of mixing vessel manifolds and/or mixing vessels; forexample, two mixing vessel manifolds can be coupled to a single mixingvessel.

The SIPM 500 includes a third dispense assembly 532. The third dispenseassembly 532 includes a number N of site manifolds 5321-532N, where thenumber N of site manifolds can be any number. The third dispenseassembly 532 of an embodiment includes twenty-eight 28 site manifolds,but the SPS is not limited to this number of site manifolds. Each sitemanifold of an embodiment includes eight (8) inputs, but is not solimited. A first input of each site manifold is connected to an outputof a mixing vessel of the first mixing assembly 514, and a second inputof each site manifold is connected to an output of a mixing vessel ofthe second mixing assembly 524. Therefore, using a first manifold 5321of the third dispense assembly 532 as a more specific example, a firstinput of the first site manifold 5321 is connected to an output of afirst mixing vessel 5141 of the first mixing assembly 514, and a secondinput of the first site manifold 5321 is connected to an output of afirst mixing vessel 5241 of the second mixing assembly 524. One or moreof the remaining inputs of each site manifold of the third dispenseassembly 532 is connected to one or more of the chemicals 501 asappropriate to the instant processing operations of the SIPM 500.Remaining inputs of each site manifold can however be coupled to otherconstituent sources in alternative embodiments. Other components (e.g.,valves, regulators, mixers, pumps, etc.) can be connected inline betweenthe constituents and the third dispense assembly 532.

Outputs of the third dispense assembly 532 are coupled to a flow cellassembly 542. The flow cell assembly 542, which is proximate to asubstrate as described above, includes a number N of flow cells5421-542N, where the number N of flow cells can be any number. As anexample, the flow cell assembly 542 of an embodiment includes 28 flowcells, but the SPS is not limited to this number of flow cells. Eachflow cell of an embodiment includes one (1) input, but is not solimited. The input of each flow cell is coupled to outputs of the sitemanifolds of the third dispense assembly 532. For example, the flow cellof an embodiment includes one (1) input that is connected to an outputof a site manifold of the third dispense assembly 532. As a morespecific example, an input of a first flow cell 5421 is connected to anoutput of a first site manifold 5321 of the third dispense assembly 532.The interior of the flow cells can be configured or reconfigured totailor fluid flow; for example, the interior cavity can be any shapeand/or the surface profiles of the interior can be varied so as tocontrol velocities of fluids. Other components (e.g., valves,regulators, mixers, pumps, etc.) can be connected inline between thethird dispense assembly 532 and the flow cell assembly 542.

The flow cell assembly 542 therefore includes a series of parallel cellsforming site-isolated reactors configured to effect site-isolatedprocessing on a proximate region of a substrate. The site-isolatedprocessing includes processing comprising the constituents orcompositions delivered to each cell or reactor of the flow cell assembly542 as described above.

The embodiment of the SIPM 500 described above includes an equivalentnumber N of each of mixing vessel manifolds of the first dispenseassembly 512, mixing vessel manifolds of the second dispense assembly522, site manifolds of the third dispense assembly 532, mixing vesselsof the first mixing assembly 514 and second mixing assembly 524, andflow cells of the flow cell assembly 542. As described above, however,alternative embodiments can include different numbers of one or more ofthe mixing vessel manifolds of the first dispense assembly 512, mixingvessel manifolds of the second dispense assembly 522, site manifolds ofthe third dispense assembly 532, mixing vessels of the first mixingassembly 514 and second mixing assembly 524, and flow cells of the flowcell assembly 542 as appropriate to a processing operations.

A controller 502 is coupled to various components of the SIPM 500 asdescribed above and controls processing operations. The SIPM 500generally provides processing operations that include global mixing ofmultiple constituents (e.g., chemicals, composition, etc.) to form avariety of combinations of compositions at each of the first mixingassembly 514 and the second mixing assembly 524. The compositions atthis mixing level are delivered to the third dispense assembly 532 atwhich point additional constituents can be sequenced with thecompositions; the resulting compositions are then delivered via the flowcells to a number N of parallel sites on a substrate. The SIPM 500,which supports liquid, gas, and/or plasma reagents, provides theresulting compositions under controlled conditions including controllingchemical composition, chemical sequencing, temperature, pH, in-linemixing, and local environment control to name a few. The SIPM 500therefore enables flow control of various reagents (having variousstates) in such a manner as to effect continuous flow of reagents tonumerous substrate site or regions in parallel. The SIPM 500 thus allowsoperators to effect parallel processing at different regions of asubstrate while managing multiple flows, flow dynamics, and multiplechannels using a minimum set of flow controls.

The SIPM 500 described above is modular and can include any number ofany of the components described above. Components (e.g., dispenseassembly, mixing vessel manifold, site manifold, mixing assembly, mixingvessels, flow cell assembly, flow cells) can be added or removed fromthe SIPM 500 as necessary to support processing operations. Furthermore,configurations of components include any number of configurations andare not limited to the configurations described above. For example,changing flow cell form factor (e.g., square instead of circular)involves changing only a top plate of the flow cell. Thus, the SPS isflexible in terms of configurability and ability to handle differenttypes of processing.

FIG. 6 shows couplings between a subset of components (collectivelyreferred to as SIPM 600) of SIPM 500, under an embodiment. The SIPM 600includes a first mixing vessel manifold 6121 that includes eight (8)inputs A-H. Each of the inputs is coupled to a constituent in order toselectively receive the constituents during processing operations. Asone example of a connection between a constituent and the first mixingvessel manifold 6121, input A of the manifold 6121 is connected tochemical A via a pump 604. The pump 604 is a metering pump used to fillthe vessels but is not so limited; alternative embodiments may notinclude the pump, may include multiple inline pumps, and/or may includea different type of pump. The pump 604 of an embodiment includes ametering pump that allows for precise control of volumetric ratios ofeach material but is not so limited. Other components (e.g., valves,regulators, mixers, pumps, etc.) can be connected inline between thecontainer holding a constituent (e.g., chemical A) and the pump 604and/or between the pump 604 and the manifold input A. Other MCSIRcomponents and/or constituents or chemicals (not shown) can be coupledto inputs A-H of the first mixing vessel manifold 6121 in a similarfashion. The first mixing vessel manifold 6121 can be a component of adispense assembly as described above, but is not so limited.

The SIPM 600 includes a mixing vessel 6141 having an input connected tothe output of the first mixing vessel manifold 6121. The mixing vessel6141 therefore receives the constituents flowed from the first mixingvessel manifold 6121. The mixing vessel 6141 of an embodiment allows forcontrol of parameters under which a composition is generated in thevessel 6141, the parameters including pressure, temperature, and pH toname a few. The mixing vessel 6141 can include devices for stirring oragitating the received constituents. The mixing vessel 6141 includes oris coupled or connected to a flow mechanism 606 that functions to flowcompositions from the mixing vessel 6141. As an example, the flowmechanism 606 includes connections for directing the composition to aprocess 608 or away from a process to waste 610; other routings (notshown) are possible. The mixing vessel 6141 can be a component of amixing assembly as described above, but is not so limited.

The SIPM 600 includes a site manifold 6321 that includes eight (8)inputs 1-8. One of the inputs 1 is connected to receive the compositionoutput MIX1 of the mixing vessel 6141. Other inputs of the site manifold6321 can be connected to receive other constituents and/or compositions.For example, as described above, another input 2 of the site manifold6321 can be connected to receive the composition output MIX2 of anothermanifold and/or mixing vessel. Further, other or remaining inputs 3-8 ofthe site manifold 6321 can be coupled to one or more other constituents(not shown).

Output of the site manifold 6321 is connected to a flow cell 6421 thatis proximate to a region of a substrate 650. The SIPM 600 includes anoptional inline mixer 660 between the site manifold 6321 and the flowcell 6421 for providing inline mixing. The flow cell 6421 receives thecomposition from the manifold 6321 and uses the composition to processthe substrate region during the processing operations. The flow cell6421 is connected to a waste line 670 that directs effluent (waste) awayfrom the flow cell 6421. The waste line 670 can include a vacuummanifold or valve (not shown) for removing process effluent from theflow cell 6421. The flow cell 6421 can be a component of a flow cellassembly as described above, but is not so limited. A controller 602 iscoupled to components of the SIPM 600 and controls processing operationsas described below.

An embodiment of SIPM 600 includes a flow meter FM in the waste line inorder to characterize the flow through the waste line rather thancharacterizing flow through the cell. This eliminates the need fornumerous flow controllers and instead requires only one flow controllerfor a single solvent system; multiple flow controllers would be usedwith multiple solvent systems (e.g., three flow controllers used insystem with acid, base and organic solvents).

The components of the SIPM, including the dispense assembly, mixingvessel manifold, mixing assembly, mixing vessels, flow cell assembly,and flow cell, vary in number and configuration as described above.These components are coupled or connected using a variety of othercomponents and/or materials that include valves, tubing or conduit,dispense pumps, flow regulators, pressure regulators, and controllers toname a few. These other components and/or materials include componentsand/or materials known in the art as appropriate to the configurationand the processing operations.

The configuration of the SIPM described above allows bulk chemicals tobe directed to a mixing vessel, through the mixing vessel manifold,and/or to the site-isolated reactor, through the site manifold. Ifdirected to the mixing vessel, the control system enables mixing ofsolutions of arbitrary composition. The composition of the solution canbe varied independently across each of the mixing vessels. The mixingvessels are implemented is such a fashion as to allow stirring, heating,and pH control of the resulting solutions. In addition, the pH andtemperature of the resulting solutions can be monitored per flow cell.Furthermore, the flow rate of each solution through the site manifoldsis independently variable.

As described above, each manifold (e.g., mixing vessel manifolds, sitemanifolds) includes a number of inputs or valves (e.g., X inputs, whereX is any number 1, 2, . . . ), with each valve coupled or connected to adifferent chemical source. The chemical source may be liquid, gas orvacuum, for example. The manifold is configured so that the chemicalsreceived at the manifold inputs exit the manifold through a common path.Consequently, the manifold is referred to as an X:1 manifold. Thechemicals can be sequenced individually through the manifold or incombinations. When sequenced in combination, an in-line mixer can beused to ensure homogeneous chemical solutions. Check valves can also beincorporate at the entrance of each of the X chemicals to ensure that nobackstreaming and, consequently, unwanted mixing of the chemicalsoccurs.

The flow cells control the flow dynamics of processes of the SIPM. Inorder to reduce dead volume between chemical changes during thesequence, the flow cells of an embodiment include independent processand waste paths incorporated directly into the cell body. FIG. 7 is ablock diagram of a flow cell 700 including independent process P1/P2 andwaste W paths, under an embodiment. Each flow cell path incorporatesvalves V1-V4 to control the process and waste flows. The use of thesevalves V1-V4 allows, for example, the first process path P1 of the flowcell to be purged while the second path P2 is being used to deliverchemicals for processing of the substrate. This process path controlprovides superior timing accuracy and enables very precise sequencing ofchemicals to a flow cell.

As an example of valve use, a valve configuration of a current processstep of a flow cell has valve V1 closed and valve V2 open resulting in afirst chemical being purged from the first path to the waste output, andvalve V4 open and valve V3 closed resulting in a second chemical beingprovided to the flow cell via the process output. Upon completion of thecurrent process step and the start of a following process step, thevalves can be switched or reconfigured in a manner such that thechemical of the first path P1 is immediately introduced to the substratevia the process output, while the chemical of the second path is purgedand the second path is subsequently prepared using the next chemical inthe process sequence.

The flow cells of an embodiment include a vacuum manifold to collect andexhaust the process chemicals from the reactor. The vacuum manifold ofan embodiment is vented to atmosphere to maintain a constant pressure inthe manifold, thereby providing superior predictability of the flowrates, but is not so limited and could instead be coupled to a vacuumsource or a pressure source as appropriate to the system configuration.

The flow cells of the SIPM are all connected to a fixture that enablesthe flow cells to be collectively raised and lowered as a unit. Thiscontrol of vertical position of the flow cells relative to the substrateallows the reactor volumes to be changed dynamically. An example of useof this function is to raise the flow cells to facilitate staticbucket-mode processing, and then to lower the flow cells to facilitate aradial flow pattern.

As described above with reference to FIG. 4, the flow cells comprise thetop surface of the site-isolated reactor, while reactor sleeves comprisethe side walls of the reactor and the processed substrate comprises thebottom of the reactor. The reactor sleeves are inert sleeves used toprovide easy serviceability. For example, the reactor sleeves can beeasily replaced if contaminated or in order to provide sleevescomprising sleeve materials that are necessary for chemicalcompatibility. The sleeves are secured by a reactor block that cancomprise one or more of a variety of materials. The reactor block canalso be automatically heated and/or cooled under control of thecontroller to provide processing temperatures that are different fromroom temperature and as appropriate to difference processes.

The MCSIR also includes a chuck or stage that secures the substrate thatis to undergo processing. The chuck can comprise one or more of avariety of mechanisms to secure the substrate including but not limitedto vacuum, electrostatics, and/or mechanical clamping. Similar to thereactor block, the chuck can also be automatically heated and/or cooledunder control of the controller. The chuck can be mechanically actuatedto enable the effective use of robotics to introduce and retrievesubstrates from the reactor assembly.

Flow control of constituents through all components of the MCSIR of anembodiment is achieved by varying pressure across connections of theMCSIR. The connections, which can each include at least one tubingconnection and/or one or more precision orifices or valves, are matchedacross the MCSIR for the constituents and constituent parameters of theintended process sequences. The connections of the MCSIR are calibratedprior to any actual use and calibration curves are stored in a databasefor each connection. The controller uses information of the calibrationsin controlling constituent flows during processing operations.

Substrate processing of the MCSIR includes parallel integration ofcombinatorial processing and conventional full-wafer processing onlocalized regions of a substrate as described above. Embodiments of theMCSIR support processing operations under control of a controller asdescribed above (e.g., controller 402 of MCSIR 400 (FIG. 4), controller502 of MCSIR 500 (FIG. 5), controller 602 of MCSIR 600 (FIG. 6)). Thecontroller includes a processor running one or more programs oralgorithms that use information of a variety of databases or tables tocontrol operations of various components of the host MCSIR; thedatabases or tables (not shown) are coupled to the controller processorand can be components of the controller and/or distributed among othercomponents of the MCSIR and/or a host processing system.

The controller of an embodiment provides full computercontrol/automation of the process sequence. Each of the reactors can beindependently controlled over most process parameters, however, someprocess parameters such as temperature and reactor volume are global toall sites. In instances where different sequences are used in differentreactors and a global parameter is changed, the controller enablessynchronization of the process steps such that the process sequenceexecutes correctly across all reactors. In addition to processsynchronization, the controller enables process sequence triggers thatenable a process step to initiate on the system meeting specific targetvalues of parameters such as temperature. These two capabilities furtherimprove the accuracy and precision with which a process sequence can beexecuted.

As a general example of controlling substrate processing operations,FIG. 8 is a flow diagram of mixed-mode processing of a substrate.Solutions are generated 802 from numerous raw chemicals. A compositionand a parameter is varied in a combinatorial fashion and independentlycontrolled between different ones of the multiple solutions. Thechemicals and solutions are dispensed 804 onto the substrate, and thedispensing includes integrating dispensing of a chemical onto an entiresurface of the substrate and dispensing of multiple solutions. Thedispensing of the multiple solutions includes independently varying oneor more of the solution dispensed and a flow among one or more sets ofregions of the substrate.

A more specific example of controlling processing operations using theMCSIR controller follows. Operation generally begins when an operatorselects and/or sets a sequence and selects and/or sets librariesappropriate to the sequence. A substrate (e.g., wafer) is loaded, andthe libraries are pre-staged. The selected processing sequence is thenexecuted. Following execution of the selected sequence the wafer isunloaded and the system is flushed.

The setting of a sequence includes defining constituent or chemicalsequencing and associated parameters. Definition of the chemicalsequencing includes for example defining one or more of the chemicaltype, flow time, flow rate, charge, soak, flush time, and processtemperature. While flow rates through each flow cell of the MCSIR of anembodiment are approximately the same value, the flow rates can bevaried in a serial manner. Flow time, soak time, and flush time can bevaried across the MCSIR. The sequencing can include chemical mixing viaone or more inline mixers, for example, as described above, or othermixing techniques or components described herein.

Setting a library for the processing sequence of an embodiment includessetting one or more of a concentration of each chemical in a mixture,temperature and pH of each solution, and a total volume of each mixture(a default value is provided from sequence information). Setting of alibrary is optional.

Wafer loading includes defining a wafer size. Pre-staging of thelibraries includes sequencing through the mixing vessels of the MCSIRand adding or dispensing the appropriate amount of each component of thespecified constituent. Precision dispense pumps are used to meterindividual constituents into the mixing vessels. Delivery of ten (10)milliliters (ml) at +/−1% accuracy takes approximately five (5) secondsin an embodiment. The MCSIR dispenses individual constituents to themixing vessels in a staggered start with a pre-specified time interval(e.g., one (1) minute) between start of the first and last constituents.Pre-staging of the libraries is targeted for a time period per stage(e.g., fifteen (15) minutes); for sequential wafers, the librarypre-staging can be executed in parallel with the process sequence. TheMCSIR pre-staging is done under conditions of precise temperature and pHcontrol, and includes integrated mixing of constituents as appropriateto the process sequence.

Execution of the selected process sequence includes initiation of thesequence, and completion of all defined processes of the selectedsequence. Data of the process sequence execution is logged as specifiedby the operator or other user. The substrate (e.g., wafer) is unloadedupon completion of the process sequence. Following removal of thesubstrate, the MCSIR is flushed to purge process effluent and/or unusedconstituents from components of the MCSIR. The MCSIR is then pressurizedwith a gas (e.g., nitrogen) and held in the pressurized state until asubsequent process sequence is initiated.

As one example of process sequencing, the MCSIR supports processing thatincludes site-isolated deposition in a region of a substrate using theSIPM described above. The deposition of a certain material requires thattwo chemicals be mixed and dispensed onto the wafer at an elevatedtemperature. The deposition must be accomplished in a static or bucketmode reactor. In addition, the chemicals can not be exposed to moisture.Finally, the chemicals are unstable at elevated temperature when mixed,but are stable when not mixed. The MCSIR enables precise control of thetiming of each step in this sequence which is critical in achievingefficient integration of this deposition into an existing process.Parameters provided in the following example are provided as examplesonly and are not intended to limit the MCSIR to processing only underthese parameters.

To execute the deposition using the MCSIR described above, and withreference to FIGS. 4-6 above, operation begins by dispensing Chemical Ainto the mixing vessel through the mixing vessel manifold. Thetemperature of Chemical A is raised to the desired process temperatureand, when Chemical A reaches the process temperature, the controllertriggers the dispensing of Chemical B into the mixing vessel. Inaddition, mechanical mixing of the two chemicals is initiated in themixing vessel.

The temperature of the solution of Chemical A and B is then raised to apre-specified process temperature. During the heating cycle, thesubstrate is moved by the interface onto a robot arm and the substratechuck is preheated to the process temperature. The substrate remains onthe robot arm until the solution reaches the process temperature atwhich point the substrate is loaded onto the hot wafer chuck. The waferis actuated into position and the solution is dispensed onto thesubstrate with the reactor at a height of approximately 10 mm.

At the conclusion of the deposition, the substrate chuck is activelycooled and the reactor height is reduced to 0.25 mm concurrent with theevacuation of the reacting solution. Upon evacuating the solution andcooling the substrate, a second solution is introduced into the reactorin flow mode to rinse the residual chemicals from the surface. The waferis then retrieved from the reactor and returned via the roboticinterface.

The MCSIR of an embodiment includes the use of seals between reactors ofthe cell assembly and one or more regions of a target substrate. Thesealing systems and methods of an embodiment can include two classes ofseals. A first class of seal includes one or more contact seals while asecond class of seal includes use of a hydrodynamic barrier formed usinga sealing fluid. Each of these sealing systems is described in detail inU.S. patent application Ser. No. 11/448,369, filed Jun. 6, 2006.

FIG. 9 shows a MCSIR 900 that includes a flow cell assembly 906 mated toa stage or chuck 904 which can secure a substrate, under an embodiment.The MCSIR 900 includes a floating reactor sleeve or wall 910. A floatingreactor sleeve 910 is configured to float or be dynamically positionablein each flow cell 908 of the cell assembly reactor block 906. Thecombination of the flow cell 908 that includes the floating sleeve 910thus forms a flow cell 908 that provides individual compliance of eachreactor edge surface 912 (formed by the floating sleeve 910) with alocalized surface of a substrate.

The compliance of each reactor sleeve 910 within the flow cell 908 ofthe reactor block 906 can be controlled or provided by an externalmechanism which, in an embodiment, is an o-ring, but is not so limited.The compliance of each reactor sleeve 910 within the flow cell 908 canalso be provided by a flexure-type mechanism integrated directly intothe sleeve wall. Each of the reactor sleeve compliance mechanisms aredescribed in detail below. Use of the floating sleeves 910 in each flowcell 908 allows for replacement of individual reactor walls that maybecome contaminated or otherwise unsuitable for continued use in areactor. Further, the floating of each flow cell 908 within the reactorblock 906 provided by the floating sleeves 910 allows largermanufacturing tolerances of reactor components while still providing ahigh probability that a seal is achieved for each reactor.

The system of an embodiment uses vacuum to provide a tertiary seal asdescribed above. The vacuum is provided via a series of vacuum channels900V in or through the reactor block 906. The vacuum works inconjunction with the face seal 900FS, which is configured to contact theprocessed substrate to ensure effective sealing by the tertiary seal.This face seal 900FS therefore establishes a perimeter seal to thesubstrate using the vacuum or alternatively using pneumatic force.

The plenum area external to the isolated reactor chambers 908 of anembodiment can be pressurized. The pressurization is used, for example,to prevent leakage of materials outside of each isolated reactor chamber908. Also, pressurizing the plenum and then measuring the pressure dropover time allows for monitoring of the sealing performance of thefloating sleeves 910. Furthermore, pressurization of the plenum preventsor minimizes the chance of release or uncontrolled venting ofpotentially toxic compounds from the isolated reactor chambers 908.

As an alternative to the contact sealing system described above a secondclass of seal, referred to herein as a hydrodynamic sealing system, usesa sealing fluid to contain reactor contents by forming a hydrodynamicbarrier between reactors of a flow cell assembly. The hydrodynamicbarrier takes the place of one or more conventional contact seals.

FIG. 10 shows a hydrodynamic sealing system 1000, under an embodiment.The hydrodynamic sealing system 1000 uses a sealing fluid 1010 to form ahydrodynamic barrier configured to be the primary containment thatisolates each reactor 1008 of a flow cell assembly from a number ofadjacent reactors 1008AA and 1008AB. The hydrodynamic sealing system1000 of an embodiment also includes a face seal 1000FS in a region ofthe perimeter of a substrate. The face seal 1000FS encapsulatesapproximately the entire area of a substrate 1002 and provides secondarycontainment of the reaction species. The sealing fluid 1010 is inert tothe reaction of one or more of the reactors 1008, 1008AA, 1008AB so thatthe sealing fluid 1010 does not introduce contamination to any reactionof any reactor 1008, 1008AA, 1008AB.

The hydrodynamic seal is provided by positioning the reactors above asurface of the substrate 1002 without substrate contact. The positioningof the reactors in proximity to the substrate 1002 results in formationof a controlled gap 1020 between the bottom portion of the reactors andthe substrate 1002. The reactors therefore do not come into physicalcontact with the substrate. The span of the controlled gap 1020 can bemodulated via the characteristics (e.g., fluid constituents,hydrophobicity, hydrophilicity, reactivity, viscosity, etc.) of thesealing fluid 1010 and/or the reactants of the reactors 1008, 1008AA,1008AB.

A hydrodynamic bearing mechanism controls the float height of thereactors 1008 above the substrate, and thus the controlled gap 1020, bycontrolling respective pressures of the sealing fluids 1010 and theeffluent channel but is not so limited. The sealing fluid 1010 isintroduced into the hydrodynamic sealing system 1000 through a first setof channels 1012 in a perimeter space 1004 or wall of the reactor 1008.The first set of channels 1012 of an embodiment includes one channel butalternative embodiments can include any number or type of channels orpassageways. Reaction fluid 1018 is also introduced into the reactor1008 and contained in the reactor 1008 for the duration of a staticreaction involving the reaction fluid 1018. The sealing fluid 1010serves to form a hydrodynamic barrier that contains the reaction fluid1018 in the reactor 1008 to which it is introduced. In one embodiment,this can be achieved by choosing an appropriate (e.g., higher) flow ofthe sealing fluid 1010 and/or (e.g., short) process duration to limitout-diffusion of the reaction fluid 1018 from the reactor 1008 to whichit is introduced. The hydrodynamic seal thus encapsulates a specificarea or region of the substrate 1002 within the reactor 1008 by limitingthe edge-to-edge flow of the reaction fluid 1018 to the approximateboundaries established by the sealing fluid 1010. Upon completion of areaction, the reaction fluid 1018 is removed from the reactor 1008(e.g., via suction) but is not so limited.

The sealing fluid 1010 is collected along with reaction effluents 1019through a second set of channels 1014 in a perimeter space 1004 of thereactor 1008. The second set of channels 1014 of the reactor perimeterspace 1004 is located between the first set of channels and the reactorto which the channels 1014 correspond, in an area defined as a sealingchannel. The second set of channels 1014 of an embodiment includes onechannel but alternative embodiments can include any number or type ofchannels or passageways. The hydrodynamic sealing system of anembodiment includes a vacuum source for collecting the sealing fluid1010 and/or reaction effluents 1019 through the second set of channels1014.

The hydrodynamic sealing system described above providesreactor-to-reactor isolation without having reactor components in directphysical contact with the substrate, thereby reducing or eliminating thepossibility of reaction contamination due to physical contact with thereactor. The hydrodynamic sealing system also provides two levels ofcontainment to ensure no leakage of reactants to the atmosphere.

The substrate processing of an embodiment is used in one or moresubstrate processing systems and processes to form material (e.g.,produces a layer or structure) on a substrate. The forming of materialon a substrate as used herein encompasses both forming the materialdirectly on the substrate material as well as forming the material onanother material previously formed on the substrate, but may not be solimited. The substrate processing enables production of very smallstructures and features on substrates (e.g., at the nanometer sizescale) at very low cost, which can be useful in the manufacture of avariety of products. Additionally, the substrate processing can takeadvantage of one or more capabilities enabled by commercial substrateprocessing apparatus and methods (e.g., commercial semiconductorprocessing equipment and methods) to facilitate and/or enhance theperformance of substrate processing to form material on a substrate.

The substrate processing can include a substrate of any size. Forexample, the substrate processing can be used in the processing of smallsemiconductor substrates having areas of less than one square inch up totwelve (12) inch (300 millimeter (mm)) or larger semiconductorsubstrates used in the production of many electronic components. Ingeneral, there is no limit to the size of substrates that can beprocessed. For example, the substrate processing can be used to processeach succeeding larger generation of semiconductor substrates used toproduce electronic components. The substrate processing can also be usedto process the relatively large substrates that are used in theproduction of flat panel displays. Such substrates include rectangularsubstrates on the order of approximately one square meter, but largersubstrates can be used. The substrate processing can also be scaled foruse in roll-to-roll processing applications for flexible substrateshaving a fixed width, but (theoretically) unlimited length (a manner ofsubstrate processing that can be particularly useful in the productionof flat panel displays); for example, such substrate rolls can behundreds of feet long.

The substrate processing can be used in the processing of a singlesubstrate or multiple substrates (e.g., batch processing). For example,in wet semiconductor processing, a single substrate can be processed ora batch of, for example, 13, 25 or 50 substrates can be processed at asingle time. In dry semiconductor processing and flat panel displayproduction, typically, a single substrate is processed at one time.

The substrate processing described herein can include wet processingand/or dry processing. In wet processing, a substrate is processed usinga fluid. For example, the substrate can be immersed, in whole or inpart, in a fluid having specified characteristics (e.g., a specifiedchemical composition). Also, for example, a fluid can be sprayed on tothe substrate in a specified manner. Wet processing for use with thesubstrate processing of an embodiment can make use of any of a varietyof chemical constituents, as appropriate for the desired processing.

In dry processing (e.g., physical vapor deposition, chemical vapordeposition, plasma-enhanced chemical vapor deposition, and atomic layerdeposition), a plasma or gas is used to produce a desired interactionwith a substrate that processes a substrate surface in a specified way.Dry processing for use with the substrate processing can make use ofinert or reactive gases, as appropriate for the desired processing.

Any of a variety of chemical constituents or other reactants(collectively referred to herein as constituents or chemicalconstituents) can be used by a substrate processing system of anembodiment to effect substrate processing and related processes. Theconstituents can be in the liquid phase, gaseous phase, and/or somecombination of the liquid and gaseous phases (including, for example,the super-critical fluid phase). The constituents used and theirconcentrations, as well as the mixture of constituents, will depend onthe particular process step(s) to be performed. The chemical deliverysystem can enable precise control of the molar concentrations,temperature, flow rate and pressure of chemical constituents asappropriate to the process. The chemical delivery system can alsoprovide appropriate filtration and control of contamination.

The above description of illustrated embodiments of the substrateprocessing systems is not intended to be exhaustive or to limit thesubstrate processing systems to the precise form disclosed. Whilespecific embodiments of, and examples for, the substrate processingsystems are described herein for illustrative purposes, variousequivalent modifications are possible within the scope of the substrateprocessing systems, as those skilled in the relevant art will recognize.The teachings of the substrate processing systems provided herein can beapplied to other processing systems and methods, not only for thesystems and methods described above.

The elements and acts of the various embodiments described above can becombined to provide further embodiments. These and other changes can bemade to the substrate processing systems in light of the above detaileddescription.

In general, in the following claims, the terms used should not beconstrued to limit the substrate processing systems to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all processing systems that operate under theclaims.

1. An integrated processing tool comprising a site-isolated reactor(SIR), wherein the SIR includes: a set of first manifolds, wherein eachof the first manifolds is coupled to a plurality of chemicals in aliquid state; a plurality of mixing vessels, wherein each mixing vesselis coupled to an output of each of the first manifolds, and wherein eachof the mixing vessels includes a stirring element; a set of secondmanifolds, wherein each of the second manifolds is coupled to an outputof multiple mixing vessels; and a plurality of flow cells, wherein eachflow cell is coupled to an output of at least one of the secondmanifolds.
 2. The tool of claim 1, wherein the set of first manifoldsincludes a plurality of inputs.
 3. The tool of claim 1, wherein one ormore of the first manifolds and the second manifolds is coupled to avacuum source.
 4. The tool of claim 1, comprising an in-line mixercoupled between a second manifold and a corresponding flow cell.
 5. Thetool of claim 1, wherein the first and second manifolds are configuredto sequence the plurality of chemicals one or more of individually or ina plurality of combinations.
 6. The tool of claim 1, wherein the set offirst manifolds is configured to vary independently a composition formedin each mixing vessel.
 7. The tool of claim 1, wherein the set of firstmanifolds is configured to vary independently a volume to each mixingvessel.
 8. The tool of claim 1, wherein each mixing vessel includes oneor more of a temperature control element and a pH control element. 9.The tool of claim 1, wherein an output of each mixing vessel is coupledto an external flow mechanism configured to selectively direct outputfrom each mixing vessel to one of the set of second manifolds or waste.10. The tool of claim 1, wherein at least one second manifold is coupledto a plurality of chemicals, and wherein an input for each of themultiple mixing vessels and for the plurality of chemicals into thesecond manifold is separate from each other.
 11. The tool of claim 1,wherein the set of second manifolds are configured to sequence one ormore of the plurality chemicals and the output of at least one mixingvessel.
 12. The tool of claim 1, wherein the set of second manifoldsfeeds a separate flow cell.
 13. The tool of claim 1, wherein the set ofsecond manifolds is configured to flow the plurality chemicals to theflow cell one or more of sequentially and simultaneously.
 14. The toolof claim 1, wherein the set of second manifolds is configured to flowthe plurality chemicals to the flow cell using one or more of serial,rapid serial, serial/parallel, and parallel delivery.
 15. The tool ofclaim 1, wherein the set of second manifolds is configured to seriallyflow the plurality chemicals to each flow cell of the plurality of flowcells.
 16. The tool of claim 1, wherein the set of second manifolds isconfigured to serially flow the plurality chemicals to each of theplurality of flow cells.
 17. The tool of claim 1, wherein the set ofsecond manifolds is configured to flow in parallel the pluralitychemicals to each flow cell of a first set of flow cells of theplurality of flow cells and a second set of flow cells of the pluralityof flow cells.
 18. The tool of claim 1, wherein the set of secondmanifolds is configured to flow in parallel the chemicals to each of theplurality of flow cells.
 19. The tool of claim 1, wherein the set ofsecond manifolds is configured to serially flow the chemicals to eachflow cell of a first set of flow cells of the plurality of flow cellsand to flow in parallel the chemicals to each flow cell of a second setof flow cells of the plurality of flow cells.
 20. The tool of claim 1,wherein a body of each flow cell includes a plurality of process pathsfor delivering compositions from the set of second manifolds.
 21. Thetool of claim 20, wherein the body includes a plurality of waste pathsfor directing waste away from the flow cell.
 22. The tool of claim 21,wherein each of the process paths and waste paths include a plurality ofvalves, wherein a configuration of the valves allows purging of a firstprocess path simultaneous with delivering compositions to the flow cellvia a second process path.
 23. The tool of claim 1, comprising a reactorblock coupled to a plurality of sleeves, wherein a set of sleeves isconfigured to receive each flow cell, wherein a set of sleeves and aflow cell in combination form a SIR vessel.
 24. The tool of claim 23,comprising a fixture coupled to the plurality of flow cells, wherein thefixture is configured to manipulate a vertical position of the pluralityof flow cells relative to the set of sleeves, wherein the fixture isconfigured to dynamically and independently control a volume of each SIRvessel.
 25. The tool of claim 1, wherein a position of the flow cells isfixed.
 26. The tool of claim 1, comprising: a third manifold coupled tothe plurality of chemicals; and a full wafer reactor coupled to thethird manifold.
 27. The tool of claim 1, comprising a full-wafer reactorcoupled to an output of at least one first manifold.
 28. The tool ofclaim 1, comprising a full-wafer reactor coupled to an output of atleast one mixing vessel.
 29. The tool of claim 1, comprising afull-wafer reactor coupled to an output of at least one second manifold.